According to the company SOI technology can provide up to a 30 percent chip performance improvement and 40 percent power reduction, compared to standard bulk silicon technology. SOI protects the transistors on the chip with a "blanket" of insulation that reduces electrical leakage, saving power and allowing current to flow through the circuit more efficiently, improving performance.

The company said that it has fabricated a test chip with an embedded dynamic random access memory (eDRAM) technology that offers density, speed and capacity better than conventional on-chip static random access memory (SRAM) as said in 32nm and 22nm technology, and comparable to what would be expected of an SRAM produced in 15-nanometer technology - three technology generations ahead of chips in volume production.

The company has added that eDRAM cell is twice as dense as any 22nm embedded SRAM cell - including the 22-nanometer memory cell announced by the company in August 2008 - and up to four times as dense as any comparable 32nm embedded SRAM in the industry. Higher memory density can lead to chips that are smaller, more efficient and can process more data, improving system performance.

The company has also added that the embedded memory is a key performance enabler for multi-core processors and other integrated circuits, and the new prototype has numerous implications for businesses and other organizations. For example, use of this technology in high-performance server, printer, storage and networking applications can result in improved system performance and energy savings. In mobile, consumer and game applications, it can result in a smaller system form-factor, lower-cost and energy savings.

The company said that it is intended to bring the benefits of its 32-nanometer SOI technology to a wide range of application-specific integrated circuit (ASIC) and foundry clients and will use the technology in chips for its servers.

Gary Patton, vice president for semiconductor research and development center at IBM, said: "We are making this 32nm offering available to clients who are ready to benefit from the significant performance and power advantages of this seventh generation of IBM SOI technology, the industry-leading, dense embedded memory, and our design library agreement with ARM, underscore our ability to provide clients with a market edge and a clear progression path to 32nm and 22nm SOI technology nodes."

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